Lead Technician, Assembly Maintenance

The Allegro team is united by a clear purpose—advancing technologies that make the world safer, more efficient, and more sustainable. With over 30 years of experience in semiconductor innovation, we bring that purpose to life across every part of the business—from breakthrough product development and customer success to how we show up for each other and the communities we serve.

The Opportunity

Allegro is seeking a highly skilled and dedicated Maintenance Technician to ensure the seamless operation and optimal performance of our advanced semiconductor manufacturing equipment. In this multifaceted role, you will be instrumental in executing routine and preventive maintenance, troubleshooting complex issues, and contributing to continuous improvement initiatives across various critical areas, including line maintenance and specialized tool and die support. This is an excellent opportunity for a hands-on professional who thrives in a dynamic environment, is committed to upholding the highest quality and safety standards, and is eager to contribute directly to our operational excellence and product quality. If you're passionate about problem-solving and optimizing machinery, join our team and help us maintain our cutting-edge capabilities.

What You Will Do

• Execute Comprehensive Maintenance: Perform daily and weekly routine maintenance activities, including machine setup, device changes, conversions, and qualifications. Conduct scheduled preventive maintenance to prevent equipment failures and ensure optimal performance.

• Diagnose & Repair Equipment: Utilize diagnostic equipment to identify problems and determine the best repair techniques. Perform setup, machine conversion, repairs, and corrective maintenance on a wide range of equipment, assisting with line maintenance activities.

• Manage Tooling & Dies: Execute tooling maintenance activities, including planned preventive maintenance of tooling and dies. Design, construct, and operate precision equipment to fabricate tools, dies, jigs, and fixtures, interpreting and analyzing technical drawings and specifications.

• Ensure Operational Continuity: Identify and resolve equipment issues to minimize downtime and maintain production efficiency. Provide technical support to the production line and communicate effectively with internal customers regarding equipment care and maintenance procedures.

• Drive Continuous Improvement: Actively participate in activities aimed at improving equipment reliability and performance. Contribute ideas for continuous improvement across all maintenance functions.

• Maintain Quality & Safety: Inspect finished products for defects and ensure they meet quality and safety standards. Report issues affecting machine uptime and product quality. Strictly follow standard operating procedures and safety protocols, ensuring all work complies with industry standards, including mandatory chemical handling training.

• Manage Inventory & Documentation: Keep detailed records of all maintenance activities, repairs, and equipment performance. Order parts from suppliers as needed and maintain inventory.

• Uphold Workplace Standards: Maintain 5S principles and perform FUGUAI checks in all assigned areas.

• Collaborate & Support: Work closely with production team members and engineers to address equipment-related issues and improve processes. Perform other related duties as assigned by immediate or next immediate superiors.

What Will You Bring

• A Degree in Electrical/Electronics/Mechanical/Computer Engineering or a Technology School Graduate qualification.

• Preferably at least one year of experience as maintenance personnel in the semiconductor industry.

• Hands-on experience with modern and latest Assembly machines is a significant advantage, including:

  • FOL: DFD Disco Saw, Esec/ASM Die Attach, KNS Wirebond, Plasma, Takatori, Mount, 3rd opt, CTECH, Oven, MCA, SMT, WBC.

  • EOL: ASM/Towa/Mphoenix Automold, ASM/Hanmi/Fosys DTFS, EO /Rofinsinar laser marking machines, Essemtec PMA machine, Ueno Seiki Inspection, Oven, CSAM, Media Deflash, MECO or Solder Plating, and other secondary machines.