Senior Packaging Project Manager

2 days ago

Paranaque City, Calabarzon, Philippines beBeePackaging Full time $90,000 - $120,000

Technical Lead Engineer Position

Job Overview

This is a challenging technical lead position requiring a strong background in semiconductor packaging and assembly engineering. The ideal candidate will have experience in managing complex projects, making technical decisions, and collaborating with cross-functional teams.

  • The successful candidate will be responsible for overseeing the design, development, and production of semiconductor packages, ensuring adherence to quality standards and project deadlines.

  • They will also be involved in problem-solving activities, such as root cause analysis and corrective action planning, to drive continuous improvement within the organization.

  • Furthermore, they will contribute to the development and implementation of process improvements, leading to increased efficiency and productivity.

Key Responsibilities

The key responsibilities of this position include:

  • Leading complex technical projects from conception to delivery, ensuring timely completion and budget adherence.

  • Making informed technical decisions regarding package design, assembly processes, and testing procedures.

  • Collaborating with cross-functional teams, including design, manufacturing, and quality assurance, to drive seamless project execution and achieve project goals.

  • Identifying and documenting project risks and resource conflicts, proposing solutions and escalating issues as necessary.

  • Developing and executing comprehensive qualification plans, performing in-depth data review, and driving corrective actions.

Requirements

To be successful in this role, the candidate must possess:

  • A Bachelor's degree in an engineering field, such as mechanical engineering, chemical engineering, or electrical engineering.

  • Minimum three to five years of experience in semiconductor packaging and assembly engineering, with a proven track record of technical project management and decision-making.

  • Demonstrated expertise in semiconductor packaging and assembly processes, with the ability to make design and process engineering decisions.

  • Strong understanding and practical application of project management principles, with an emphasis on technical leadership.

  • Excellent written and spoken English language fluency, with strong communication and interpersonal skills.

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