Staff Packaging Project Engineer

The Allegro team is united by a clear purpose—advancing technologies that make the world safer, more efficient, and more sustainable. With over 30 years of experience in semiconductor innovation, we bring that purpose to life across every part of the business—from breakthrough product development and customer success to how we show up for each other and the communities we serve.

This role demands advanced expertise in package design, assembly process engineering, and strategic problem-solving. The Principal Project Engineer will drive project success across multiple concurrent initiatives, provide technical leadership and mentorship, and is responsible for managing and updating Allegro's package design rules, ensuring alignment with corporate objectives and the highest quality standards.

• Lead and independently manage complex and strategic packaging projects, ensuring their successful completion on time, within budget, and within scope.

• Act as a principal expert in semiconductor packaging and assembly, providing advanced technical guidance and making critical decisions on package design and assembly process engineering, including leading complex problem identification, root cause analysis, and resolution.

• Drive the creation and evolution of bonding diagrams and other critical package design elements, setting standards and best practices for Allegro's design rules.

• Lead strategic bill of material selection and qualification strategies, optimizing for long-term performance, cost, and manufacturability across product lines.

• Oversee and approve comprehensive assembly data review and qualification data review processes, ensuring robust data analysis and critical decision-making.

• Strategically define project scope, objectives, and resource requirements, proactively identifying and mitigating potential roadblocks.

• Develop and implement advanced project tracking and reporting mechanisms, providing high-level, strategic updates to the Technical Project Manager and senior leadership.

• Proactively anticipate and mitigate critical risks and resource conflicts, developing comprehensive contingency plans.

• Drive collaboration across highly complex, cross-functional teams, including external partners, to ensure seamless project execution and strategic alignment.

• Establish and enforce best practices for Advanced Quality Planning (AQP) and internal documentation procedures, ensuring robust project records and compliance.

• Lead and oversee sophisticated problem-solving initiatives, including advanced Ishikawa (Fishbone) or 8D analyses, for critical project issues or quality deviations.

• Serve as a subject matter expert and mentor in the application of quality tools such as DFMEA, PFMEA, Ishikawa, DRBFM, Design for Manufacturability, Design for Quality, and Design for Cost, driving their effective implementation across projects.

• Manage and update Allegro's package design rules, ensuring they reflect current best practices and future technological needs.

• Maintain comprehensive and strategic project documentation, including detailed schedules, budget forecasting, and technical specifications.

• Serve as a primary interface with Business Units, product lines, and potentially external customers/vendors for strategic project updates and alignment on critical project strategies and resource allocation.

• Mentor and provide technical guidance to junior and mid-level project engineers, fostering technical growth within the team.

• Master's degree (MS) in an engineering field such as Mechanical Engineering, Chemical Engineering, or Electrical Engineering.

• Minimum of five (5) to ten (10) years of progressive experience in semiconductor packaging and assembly engineering, with a proven track record of leading complex technical projects and making significant design and process engineering decisions.

• Demonstrated advanced expertise in semiconductor packaging and assembly processes, with the ability to drive innovation and strategic improvements.

• Expert understanding and practical application of advanced project management principles and methodologies, with a strong emphasis on technical leadership and strategic planning.

• Exceptional proficiency in utilizing and mentoring others on quality tools such as DFMEA, PFMEA, Ishikawa, DRBFM, Design for Manufacturability, Design for Quality, and Design for Cost.

• Exceptional organizational skills, meticulous attention to detail, and superior problem-solving and analytical capabilities.

• Excellent written and spoken English language fluency, with highly developed communication, negotiation, and interpersonal skills.

• Advanced proficiency in Microsoft Excel and Microsoft PowerPoint.

• Knowledge and/or experience of semiconductor packaging and assembly processes (more emphasized for lower levels, assumed for higher levels) is preferred.