Senior Packaging Project Manager

2 days ago

Paranaque City, Calabarzon, Philippines beBeeProject Full time $150,000 - $200,000

The ideal candidate for this role will have a proven track record of delivering complex technical projects and making significant design and process engineering decisions.

Key Responsibilities:

  • Lead and independently manage complex packaging projects, ensuring their successful completion on time, within scope.

  • Act as a principal expert in semiconductor packaging and assembly, providing advanced technical guidance and making critical decisions on package design and assembly process engineering.

  • Drive the creation and evolution of bonding diagrams and other critical package design elements, setting standards and best practices for the company's design rules.

  • Oversee and approve comprehensive assembly data review and qualification data review processes, ensuring robust data analysis and critical decision-making.

  • Strategically define project scope, objectives, and resource requirements, proactively identifying and mitigating potential roadblocks.

  • Develop and implement advanced project tracking and reporting mechanisms, providing high-level, strategic updates to senior leadership.

  • Proactively anticipate and mitigate critical risks and resource conflicts, developing comprehensive contingency plans.

  • Drive collaboration across highly complex, cross-functional teams to ensure seamless project execution and strategic alignment.

  • Establish and enforce best practices for Advanced Quality Planning (AQP) and internal documentation procedures, ensuring robust project records and compliance.

  • Lead and oversee sophisticated problem-solving initiatives, including advanced Ishikawa or 8D analyses, for critical project issues or quality deviations.

  • Serve as a subject matter expert and mentor in the application of quality tools such as DFMEA, PFMEA, Ishikawa, DRBFM, Design for Manufacturability, Design for Quality, and Design for Cost.

  • Manage and update the company's package design rules, ensuring they reflect current best practices and future technological needs.

  • Maintain comprehensive and strategic project documentation, including detailed schedules, budget forecasting, and technical specifications.

  • Provide technical guidance to junior and mid-level project engineers, fostering technical growth within the team.

Requirements:

  • Master's degree in an engineering field, such as Mechanical Engineering, Chemical Engineering, or Electrical Engineering.

  • Minimum of five to ten years of progressive experience in semiconductor packaging and assembly engineering, with a proven track record of leading complex technical projects.

  • Demonstrated advanced expertise in semiconductor packaging and assembly processes, with the ability to drive innovation and strategic improvements.

  • Expert understanding and practical application of advanced project management principles and methodologies, with a strong emphasis on technical leadership and strategic planning.

  • Exceptional proficiency in utilizing and mentoring others on quality tools such as DFMEA, PFMEA, Ishikawa, DRBFM, Design for Manufacturability, Design for Quality, and Design for Cost.

  • Excellent written and spoken English language fluency, with highly developed communication, negotiation, and interpersonal skills.

  • Advanced proficiency in Microsoft Excel and Microsoft PowerPoint.

  • Knowledge and/or experience of semiconductor packaging and assembly processes is preferred.

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