Process Engineer

The Allegro team is united by a clear purpose—advancing technologies that make the world safer, more efficient, and more sustainable. With over 30 years of experience in semiconductor innovation, we bring that purpose to life across every part of the business—from breakthrough product development and customer success to how we show up for each other and the communities we serve.

The Opportunity:

This role is a pivotal role within our semiconductor assembly operations, responsible for the advanced development, optimization, and continuous improvement of critical manufacturing processes. This position demands a subject matter expert with a proven track record in Die Prep, Die Attach, and Wirebond processes, who can leverage experimental design, robust engineering principles, and advanced statistical methods to drive manufacturability, yield, and quality enhancements. The Senior Process Engineer will lead strategic initiatives, evaluate new technologies, and ensure the seamless transition of new products into high-volume production, while mentoring junior engineers and collaborating extensively with cross-functional teams.

Advanced Process Development & Optimization:

• Lead the conceptualization, setup, and advanced development of new and existing assembly processes, focusing on Die Prep, Die Attach, and Wirebond operations.
• Drive parameter optimization through rigorous experimental designs (DOE), precise process variable definitions, and robust design engineering principles to achieve industry-leading manufacturability, yield, and quality for continuous improvement.
• Proactively conceive, source, and test alternative and innovative methods/processes to significantly enhance manufacturing efficiency, product yield, and overall quality.

Risk Management & Quality Assurance:

• Spearhead the generation and critical review of Failure Mode and Effects Analysis (FMEA) for all new assembly processes, and meticulously review and update existing FMEAs to proactively identify and mitigate potential risks and failure modes.
• Interpret and enforce stringent quality inspection criteria and specifications, ensuring all products meet or exceed internal and external quality standards.

Equipment, Tooling & Material Innovation:

• Design, develop, and/or qualify specialized jigs, fixtures, and tools to significantly enhance machine efficiency, improve product quality, and reduce manufacturing defects.
• Generate, critically review, and approve comprehensive equipment specifications and qualification procedures, including all supporting documentation required for Production Acceptance Review (PAR) of new equipment.
• Lead machine qualification and ongoing monitoring activities, including conducting thorough equipment buy-off at supplier sites. Recommend and implement strategic machine modifications or upgrades to optimize performance, reliability, and cost-effectiveness.
• Actively source, evaluate, and recommend alternative materials to reduce manufacturing costs, enhance product quality, and improve manufacturability without compromising reliability.

New Product Introduction (NPI) & Qualification:

• Determine and validate machine and process capabilities for new products, ensuring readiness for high-volume manufacturing.
• Ensure that engineering lots for new devices and packages are assembled in strict conformance to all design and process requirements, meticulously reporting and addressing any process concerns.
• Plan, design, implement, and monitor activities geared towards improving product and material yield, reducing production costs, and minimizing product reliability defects during NPI and beyond.

• Bachelor's degree in Electrical Engineering, Electronics and Communication Engineering, Mechanical Engineering, Materials Engineering, Metallurgical Engineering, Chemical Engineering, Manufacturing Engineering, Industrial Engineering, or a closely related technical field.
• Minimum of 3 years of hands-on, progressive experience in a Process Engineering role within the semiconductor manufacturing industry, with a strong focus on assembly operations.
• Demonstrated experience and considered a Subject Matter Expert (SME) in Die Prep, Die Attach, and Wirebond processes .
• Proven track record in process setup, advanced development, parameter optimization through experimental design, and robust design engineering.
• Experience in FMEA generation/review, equipment qualification, and material evaluation.
• Deep and comprehensive knowledge of semiconductor assembly processes (specifically Die Prep, Die Attach, and Wirebond) and associated advanced equipment.
• Proficient in generating detailed technical reports, defining precise manufacturing specifications, and developing robust process documentation.
• Strong understanding of electronic, mechanical, and electro-mechanical theories, coupled with practical experience in using appropriate electrical, electronic, and mechanical tools and instruments for advanced troubleshooting and analysis.
• Expertise in applying core quality tools, including Advanced Product Quality Planning (APQP), Failure Mode and Effects Analysis (FMEA), Measurement System Analysis (MSA), Statistical Process Control (SPC), and Production Part Approval Process (PPAP).
• Advanced proficiency in statistical data analysis software (e.g., JMP, Minitab) for process monitoring, optimization, and root cause analysis.