Engineer I

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Job Description:

Job Summary :

The Failure Analysis (FA) Engineer performs detailed electrical and physical failure analysis for MCHP products using non-destructive analytical tools, curve tracing, electrical ATE and bench characterization, defect/fault localization, sample preparation, destructive physical FA techniques, and material analysis. Responsible for providing FA reports, regular FA updates, and timeline to customers. Works with different cross-functional team such as FA counterparts, CQE, Quality, Reliability, Apps, Design, Foundry, Test and Product Engineering, and Wafer fab as appropriate to resolve FA cases. 

Specific Duties & Responsibilities:

• Performs detailed electrical and physical failure analysis for cutting edge products using non-destructive analytical tools (such as X-ray, Scanning Acoustic Microscope (SAM), and Optical microscopes), electrical bench verification tools and ATE datalog interpretations, circuit schematics interpretation, fault isolation techniques (such as Photo Emission Microscope (PEM), Thermal Emission/Hotspot Analysis, Optical Beam-Induced Resistance Change (OBIRCH), and die level microprobing), deliding/delayering techniques (such as chemical and laser decapsulation, chemical etch, dry etch, mechanical polishing, or combination of different etches), and SEM/EDX analysis.
• Works with fellow engineers both local and other Failure Analysis engineering counterparts from different Microchip sites to develop failure analysis techniques and capabilities if needed.
• Works with different cross-functional team such as FA counterparts, CQE, Quality, Reliability, Apps, Design, Foundry, Test and Product Engineering, Line Engineering and technicians, and Wafer fab as appropriate to resolve FA cases. 
• Works with external or 3rd party FA laboratory to utilize advanced FA technique capabilities needed for analysis.
• Reviews assigned failure analysis case and request additional information if needed.
• Ensures that historical data are reviewed for any relevant information that can be used for the analysis.
• Performs and/or reviews initial analysis and define appropriate next analysis steps.
• Provides regular FA updates and timeline to customer.
• Ensures that FA reports are release on time based on target average cycle time.
• Trains/Mentors/Assists new hires FA Engineers, technicians, and inspectors.
• FA focal person responsible in advanced tools/equipment 5S and improvements and coordination with FAREL Equipment group for consumables & spare parts procurements, repair, and maintenance.
• Generates comprehensive failure Analysis Report based on analysis findings.
• Supports Environmental Management Systems and Quality Management Systems standards
• Observe safety and housekeeping "Clean as you go" during day-to-day failure analysis activities.
• Develops and implements new failure analysis methods if necessary.

Requirements/Qualifications:

• Has less than two (2) years relevant experience in a semiconductor or electronics manufacturing environment with work experience from Quality and Reliability, Failure Analysis, Product or Process Engineering.
• New College Graduate could be considered with strong fundamentals in electronic, material science, and programming skills.

Other Requirements

• Satisfactory knowledge and experience in electronic /electrical circuit and material analysis.
• Able to extract, analyze, and report data as necessary.
• Computer literate (MS Word, PowerPoint, and Excel).
• Able to communicate and coordinate throughout all levels and functions of the organization as a team player with little supervision.
• Satisfactory knowledge of tools and methods related to inspection and analysis of components of both package and die form in semiconductor industry environment.
• Satisfactory interpersonal and communication skills (verbal and written) with the capability to interface throughout all levels and functions.

Travel Time:

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