FOL Diebond/Clipbond Supervisor

Description

The Equipment Engineer will be responsible for ensuring optimal performance, reliability, and efficiency of manufacturing equipment, with a strong focus on automation and process improvement. This role requires both technical expertise and leadership capability to drive equipment-related projects, lead cross-functional initiatives, and support the integration of advanced automation technologies in semiconductor manufacturing.

 

Responsibilities

•Lead equipment engineering activities for Front-of-Line (FOL), ensuring high equipment uptime and reliability.

•Develop and implement automation solutions to improve productivity, reduce manual intervention, and enhance process control.

•Manage equipment qualification, buy-off, and installation for new tools and automation systems.

•Drive continuous improvement projects focused on yield enhancement, cycle time reduction, and cost savings.

•Collaborate with cross-functional teams (Process, Quality, Production, IT) to integrate automation systems and resolve equipment-related issues.

•Create and maintain preventive maintenance programs and ensure compliance with safety and quality standards.

•Analyze equipment performance data using advanced analytics and recommend corrective actions.

•Provide technical leadership and mentorship to junior engineers and technicians.

•Prepare reports and present project updates to management.

Qualifications

•Education

oBachelor's degree in Mechanical, Electrical, Electronics, Mechatronics, or Automation Engineering.

oAdvanced degree or certifications in automation systems is an advantage.

•Experience

oMinimum 5 years in semiconductor or electronics manufacturing equipment engineering.

oProven experience in automation projects and system integration.

oLeadership experience in managing projects or small teams is preferred.

•Skills and Knowledge Requirement

oTechnical Skills:

oStrong knowledge of semiconductor equipment (Die Attach, Wire Bond).

oExpertise in automation technologies (PLC programming, robotics, vision systems, sensors).

oFamiliarity with Industry 4.0 concepts and smart manufacturing solutions.

oProficiency in data analysis tools and equipment monitoring systems.

oSoft Skills:

oStrong leadership and project management skills.

oExcellent communication and collaboration abilities.

oProblem-solving mindset with a focus on innovation and continuous improvement.

oOther Requirements:

oAbility to work in a fast-paced environment and manage multiple priorities.

oKnowledge of quality systems (PFMEA, Control Plans, SPC) and compliance standards.

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