Wire Bond Process Engineer: Optimize Yield
3 days ago
Philippines
Onsemi
Full-time
₱600,000 - ₱900,000 Contract
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onsemi is seeking a Wire Bond Process Engineer to optimize ultrasonic wire bonding for semiconductor production, focusing on yield, quality, and cost efficiency. You will lead DoE studies, resolve defects, and mentor junior staff while supporting NPI and equipment qualification.
The role requires a strong background in ultrasonic bonding, materials knowledge (Au, Cu, Al wires), and hands-on troubleshooting with diverse bonders. Collaboration with cross-functional teams is essential.