GaN Package Engineering Lead — Thermal

3 days ago

Muntinlupa, Metro Manila, Philippines Navitas Semiconductor Full-time ₱2 - ₱3 Contract

Navitas Semiconductor in the Philippines seeks a senior package design engineer to drive internal assembly design of GaN devices, BOM and process flow in a target footprint. You will lead cross-functional reviews and collaborate with OSAT development and Navitas Operations/NPI teams to mitigate risks and finalize designs.

Responsibilities include package development, validation of designs and materials, reliability look-ahead evaluations, final POR qualification, and comprehensive documentation