GaN Package Engineering Lead — Thermal
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Navitas Semiconductor in the Philippines seeks a senior package design engineer to drive internal assembly design of GaN devices, BOM and process flow in a target footprint. You will lead cross-functional reviews and collaborate with OSAT development and Navitas Operations/NPI teams to mitigate risks and finalize designs.
Responsibilities include package development, validation of designs and materials, reliability look-ahead evaluations, final POR qualification, and comprehensive documentation