Senior Packaging Project Engineer

6 days ago

Parañaque, Philippines Allegro MicroSystems Full time

The Allegro team is united by a clear purpose—advancing technologies that make the world safer, more efficient, and more sustainable. With over 30 years of experience in semiconductor innovation, we bring that purpose to life across every part of the business—from breakthrough product development and customer success to how we show up for each other and the communities we serve.

The Opportunity

The Packaging Project Engineer II is responsible for executing technical projects related to semiconductor packaging with increasing independence, applying growing expertise in package design and assembly processes. This role involves managing individual projects, contributing directly to technical decisions, and ensuring adherence to project scope, schedule, budget, and quality requirements. The Project Engineer II will effectively utilize quality tools and collaborate closely with cross-functional teams.

What You Will Do

  • Manage and execute assigned packaging projects, ensuring they are completed on time, within budget, and within scope.

  • Create and refine bonding diagrams according to Allegro design rules.

  • Participate in bill of material selection, making recommendations based on technical requirements and project objectives.

  • Develop and execute qualification plans, ensuring all necessary tests and data are collected.

  • Perform detailed assembly data review and qualification data review, identifying issues and proposing solutions.

  • Contribute to technical discussions on package design and assembly process improvements.

  • Track critical tasks and milestones, proactively identifying and addressing potential delays or issues.

  • Identify, document, and escalate project risks and minor resource conflicts to the Technical Project Manager.

  • Collaborate with cross-functional teams, including design, product lines, manufacturing, and quality, to ensure seamless project execution.

  • Ensure all project deliverables adhere to Advanced Quality Planning (AQP) requirements and internal documentation procedures.

  • Participate in problem-solving activities, such as Ishikawa (Fishbone) or 8D analyses, when project issues arise.

  • Effectively utilize quality tools such as DFMEA, PFMEA, Ishikawa, DRBFM, Design for Manufacturability, Design for Quality, and Design for Cost.

  • Maintain comprehensive project documentation, including schedules, budgets, and technical specifications.

What You Will Need

  • Bachelor's degree (BS) in an engineering field such as Mechanical Engineering, Chemical Engineering, or Electrical Engineering.

  • Minimum of one (1) to three (3) years of experience in technical project execution or engineering roles, preferably in the semiconductor or related industry.

  • Good understanding of project management principles and practices, with a strong focus on technical problem-solving.

  • Developing technical expertise in semiconductor packaging and assembly processes.

  • Demonstrated ability to effectively use quality tools such as DFMEA, PFMEA, Ishikawa, DRBFM, Design for Manufacturability, Design for Quality, and Design for Cost.

  • Highly organized with excellent attention to detail and developing problem-solving skills.

  • Excellent written and spoken English language fluency.

  • Proficiency in Microsoft Excel and Microsoft PowerPoint.

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