Die Bonding Process Engineer – Onsite, Yield

Job Description Primary Duties & Responsibilities Optimize, qualify, and sustain die-bonding processes for chip on carrier/submount products Establish process parameters and thermal profiles to achieve proper alignment, solder quality, bond strength, thermal performance, and product reliability Conduct DOE, process capability studies, SPC, GR&R, and...

Job Description Primary Duties & Responsibilities Lead the development, optimization, and qualification of manufacturing processes on both assembly and test Drive improvements in yield, quality, process capability, productivity and cost through data-driven problem solving Manage product transfer, equipment commissioning, process validation, and...

Primary Duties & Responsibilities Lead end-to-end integration of assembly and test manufacturing processes whereby no changes will be implemented without his/her thorough review and approval Lead structured problem-solving and root-cause investigations involving multiple processes, equipment, materials, and test systems. Evaluate the impact of process...