Lead DYE Engineer

Overview

The Allegro team is united by a clear purpose—advancing technologies that make the world safer, more efficient, and more sustainable. With over 30 years of experience in semiconductor innovation, we bring that purpose to life across every part of the business—from breakthrough product development and customer success to how we show up for each other and the communities we serve.

The Device Yield Enhancement Engineer is a critical role responsible for driving continuous improvement in product YIELD and quality across the semiconductor manufacturing process, from FAB to final test. This individual will lead complex engineering analyses, identify root causes of yield loss, and implement robust solutions in close collaboration with cross-functional teams. The successful candidate will leverage strong analytical skills, a deep understanding of semiconductor processes, and a proactive approach to ensure optimal product performance and cost efficiency.

Yield Analysis and Improvement Leadership

• Lead and execute complex FAB improvement projects aimed at enhancing overall device YIELD , quality, and reliability.
• Perform in-depth engineering analysis on low YIELD lots, maverick material, and customer return (CI reject) data to identify root causes of performance deviations and defects.
• Conduct detailed FAB evaluation correlation analysis to link wafer-level characteristics with downstream product performance.
• Develop and implement corrective actions and preventative measures to resolve yield detractors and improve manufacturing efficiency.
• Generate comprehensive reports on FAB issues, product performance (including YIELD , RMA rates, and scrap rates), and improvement project status for various stakeholders.

Cross-Functional Collaboration & Stakeholder Management:

• Serve as a primary technical interface with internal and external partners, including Wafer FAB foundries, R&D, Allegro's global Device Yield Enhancement (DYE) team, Design, Process, Test, Reliability, and Manufacturing Engineering teams.
• Actively manage and resolve FAB foundry issues, including excursion containment, root cause analysis, and long-term issue resolution, ensuring minimal impact on production and YIELD .
• Manage RMA (Return Material Authorization) lots and requirements, coordinating analysis and resolution with relevant teams.

Process Monitoring & Optimization:

• Monitor and drive improvements in Probe and Final Test YIELD s, analyzing influences from Wafer FAB / evaluation, Design, and Test processes.
• Review probed materials to proactively identify new YIELD issues and determine if adequate Good Die Inking (GB Inking) is required.
• Coordinate with Manufacturing Product Engineers (MPE), operations, and planners to effectively run engineering lots and experiments, ensuring data integrity and efficient execution.
• Initiate and drive the implementation of new systems, procedures, and services for continuous process and YIELD improvement.

• Education:
  • Bachelor's degree in Electrical Engineering, Electronics Engineering, Chemical Engineering, Materials Science and Engineering, Physics, or a closely related technical field.
• Experience:
  • Minimum of 4 years of hands-on experience in a semiconductor manufacturing environment, specifically within FAB , Probe, Test, or Product Engineering roles.
  • Demonstrated experience in driving YIELD improvement projects and performing root cause analysis for complex semiconductor devices.
  • Proven track record of managing foundry issues, including excursion containment and resolution.
• Technical Skills:
  • Strong knowledge of semiconductor device physics and manufacturing processes (FAB , assembly, test).
  • Proficiency in statistical data analysis tools (e.g., JMP, Minitab, R, Python for data analysis) and extensive experience with statistical process control (SPC).
  • Experienced in the application of advanced statistical techniques for machine assessments such as Measurement System Analysis (MSA) and Failure Mode and Effects Analysis (FMEA).
  • Familiarity with Automated Test Equipment (ATE) and test methodologies.
  • Knowledge of failure analysis techniques (e.g., SEM, FIB, OBIRCH) is a significant plus.
• Soft Skills:
  • Excellent analytical and problem-solving skills with a meticulous attention to detail.
  • Strong interpersonal and communication skills, with the ability to effectively collaborate with diverse cross-functional teams and present complex technical information clearly.
  • Demonstrated leadership capabilities, including the ability to influence and drive results without direct authority.